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半導體生產設備耗材‧ 面板工業設備耗材‧光電工業原料應用及設備耗材‧太陽能產業設備耗材
CE
Superior material specifically developed for applications in Semiconductor Industry
High purity 99.8%
High purity 99.8%
Controlled grain size and controlledaverage grain size
High density
Minimal content of glassy boundaries
EDX results directly proved glass exists mainly within triple junction instead of grain boundary.
APPLICATION
Semiconductor chamber components
TFT.LCD chamber component
High Plasma/chemical resistance require
Precision/structure ceramic component
QZ
OEM Approved Material Only
Available for customized material
Material Character
Exceedingly low bubble content and excellent ultra-violet
Stable chemically and nice acid resistance
High thermal chock resistance and low thermal conductivity
High compressive strength and high theoretical tensile strength
High compressive strength and high theoretical tensile strength
APPLICATION
Semiconductor Etch process
Semiconductor PVD process
Well-Plasma/chemical resistance required process
SI
OEM Approved Material Only
Available for customized material
Material Character
Single Crystalline Silicon
1-0-0 Crystal Orientation
Overall Purity > 99,99995% [= “7N”]
Na,Al,Cr,Fe,Ni,Cu<0,005 ppm per element
Oxide Concentration : <1,00*1018 atoms/cm3
P-Type(Boron Doped)
Electrical Resistivity:1 – 5 Ohm.cm
Slip Free (no Lineage)
APPLICATION
Semiconductor Etch process
Ring Shape
Cathode